On January 2, 2026, the Ministry of Electronics and Information Technology (MeitY), Government of India (GoI), approved 22 additional proposals worth Rs.41,863 crores under the Electronics Components Manufacturing Scheme (ECMS) as part of the third tranche of clearances under ECMS.
- With this, the cumulative approvals under the ECMS now stand at 46 projects, with a total investment of Rs. 56,567 crore.
Exam Hints:
- What? 22 New Proposals approved
- Approved by: MeitY
- Scheme: Electronics Components Manufacturing Scheme (ECMS) – 3rd tranche
- Investment Value: Rs. 41,863 crore
- Cumulative Approvals: 46 projects, total investment Rs. 56,567 crore
- Key Product Segments:
- Bare Components: PCBs & HDIs, Capacitors, Connectors, Enclosures, Lithium-ion cells
- Sub-Assemblies: Camera Modules, Display Modules, Optical Transceivers
- Supply Chain Materials: Aluminium Extrusions, Anode Material (Li-ion cells), Copper Clad Laminates.
About 22 New Proposals under ECMS:
11 Key Products Approved: The 22 approved projects span 11 key electronics product segments that are critical for modern devices and systems, including:
- Bare Components: Printed Circuit Boards(PCBs) & High-Density Interconnects (HDIs), Capacitors, Connectors, Enclosures, Lithium-ion cells.
- Sub-Assemblies: Camera Modules, Display Modules, Optical Transceivers
- Supply Chain Materials: Aluminium Extrusions, Anode Material (for Li-ion cells), Copper Clad Laminates (for PCBs)
Geographical Spread: The projects are spread across 8 states such as Andhra Pradesh (AP), Haryana, Karnataka, Madhya Pradesh (MP), Maharashtra, Tamil Nadu (TN), Uttar Pradesh (UP), and Rajasthan.
List of Companies and their approved products under the ECMS:
| S.No | Name of Company | Approved Product |
|---|---|---|
| 1 | India Circuits Private Limited | Printed Circuit Boards (PCBs) |
| 2 | Vital Electronics Private Limited | |
| 3 | Signum Electronics Limited | |
| 4 | Epitome Components Private Limited | |
| 5 | BPL Limited | |
| 6 | AT & S India Private Limited | |
| 7 | Ascent-K Circuit Private Limited | |
| 8 | CIPSA TEC India Private Limited | |
| 9 | Shogini Technoarts Private Limited | |
| 10 | Deki Electronics Limited | Capacitors |
| 11 | TDK India Private Limited | |
| 12 | Amphenol High Speed Technology India Private Limited | Connectors |
| 13 | Yuzhan Technology (India) Private Limited | Enclosures |
| 14 | Motherson Electronics Components Private Limited | |
| 15 | Tata Electronics Private Limited | |
| 16 | ATLbattery Technology (India) Private Limited | Li-ion Cells |
| 17 | Dixon Electroconnect Private Limited | Optical Transceiver (SFP) |
| 18 | Kunshan Q Tech Microelectronics (India) Private Limited | Camera Module Sub-Assembly |
| 19 | Samsung Display Noida Private Limited | Display Module Sub-Assembly |
| 20 | NPSPL Advanced Materials Private Limited | Anode Material (for Li-ion cells) |
| 21 | Wipro Global Engineering and Electronic Materials Private Limited | Laminate (Copper Clad for PCBs) |
| 22 | Hindalco Industries Limited | Aluminium Extrusion (Mobile Enclosures) |
About Electronics Components Manufacturing Scheme(ECMS):
Launch: ECMS is a flagship initiative launched by MeitY in 2025 for a period of six years from Financial Year 2025-26 (FY26) to Financial Year 2031-32 (FY 32), including an optional 1-year gestation period, with an aim to significantly boost domestic manufacturing of electronic components and sub-assemblies in India.
- It was approved by the Union Cabinet in 2024 with the total financial outlay of Rs.22,919 crores under the GoI’s vision of Make in India.
Implementation:The ECMS is administered by the MeitY and works in partnership with state governments, industry associations, and approved project companies to boost and strengthen domestic electronics manufacturing in India.
Incentive Structure: It includes Turnover-linked incentives, paid based on revenue from increased output; Capital Expenditure (Capex)-linked incentives, linked to capital investment; and Hybrid incentives, a combination of both turnover and capex support for selective categories.
Target Segments: Includes sub‑assemblies (e.g., display modules, camera modules), bare components (e.g., PCBs, Li‑ion cells, enclosures), selected bare components (e.g., HDI/flexible PCBs), and supply chain ecosystem & capital equipment.
About Ministry of Electronics and Information Technology (MeitY):
Union Minister – Ashwini Vaishnaw (Rajya Sabha – Odisha)
Minister of State (MoS) – Jitin Prasada (Constituency – Pilibhit, Uttar Pradesh, UP).
